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    Localization of Key Materials of "China Core"

    Precursor Materials
    Electronic Special Gases
    Photoresists and Supporting Materials
    Tetrakis(dimethylamido) Hafnium (TDMAH)
    Tetrakis(dimethylamido) Hafnium (TDMAH)
    • English Name: Tetrakis(dimethylamido) Hafnium (TDMAH)
    • CAS No.: 19782-68-4
    • Melting Point: 26-29℃
    • Boiling Point: 60℃（0.01hPa）
    • Vapour Pressure: lgp(Torr) = 9.99-3377/T(K)
    • Storage Temperature: ≤51℃
    • Product Grade: Adduct
    • Specifications: 50g/100g/200g
    Tetrakis(dimethylamino) Tin （TDMASn）
    Tetrakis(dimethylamino) Tin （TDMASn）
    • English Name: Tetrakis(dimethylamino) Tin (TDMASn)
    • CAS No.:1066-77-9
    • Melting Point: NA
    • Boiling Point: 54℃ at 0.1 Torr
    • Vapour Pressure: 0.2 Torr at 300 K
    • Storage Temperature: ≤51℃
    • Product Grade: Adduct
    • Specifications: 50g/100g
    Tungsten Hexacarbonyl (HCW)
    Tungsten Hexacarbonyl (HCW)
    • English Name: Tunten Hexacarbonyl (HCW)
    • CAS No.: 14040-11-0
    • Melting Point:150℃
    • Boiling Point:NA
    • Vapour Pressure:1.6 hPa at 67 ℃
    • Storage Temperature: ≤51℃
    • Product Grade: Adduct
    • Specifications: 50g
    37W% TMI THF Solution （TTMIN）
    37W% TMI THF Solution （TTMIN）
    • English Name: 37W% TMI THF Solution (TTMIN)
    • CAS No.: NA
    • Melting Point: NA
    • Boiling Point: NA
    • Vapour Pressure: NA
    • Storage Temperature: ≤51℃
    • Product Grade: Adduct
    • Specifications: Customized
    Triisobutylaluminum （TIBAl）
    Triisobutylaluminum （TIBAl）
    • English Name: Triisobutylaluminum (TIBAl)
    • CAS No.: 100-99-2
    • Melting Point: 4-6°C
    • Boiling Point: 68-69 ℃
    • Vapour Pressure: 0.13kPa（47℃）
    • Product Grade: Adduct
    • Specifications: customized
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